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1

Minimizing communication risk in construction: a Delphi study of the key role of project managers

Journal:

Journal of Civil Engineering and Management

Year:

2014

Language:

english

File:

PDF, 534 KB

english, 2014

2

Stress Evolution During Nanoindentation in Open TSVs

Papaleo, Santo, Zisser, Wolfhard H., Singulani, Anderson P., Ceric, Hajdin, Selberherr, Siegfried

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2016

Language:

english

File:

PDF, 671 KB

english, 2016

3

The challenge of a single Muslim authority in Europe

Journal:

Year:

2007

Language:

english

File:

PDF, 134 KB

english, 2007

4

Comparison of analytic distribution function models for hot-carrier degradation modeling in nLDMOSFETs

Sharma, P., Tyaginov, S., Wimmer, Y., Rudolf, F., Rupp, K., Enichlmair, H., Park, J.-M., Ceric, H., Grasser, T.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.37 MB

english, 2015

5

Interface traps density-of-states as a vital component for hot-carrier degradation modeling

S.E. Tyaginov, I.A. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello, J.M. Park, H. Enichlmair, M. Karner, Ch. Kernstock, E. Seebacher, R. Minixhofer, H. Ceric, T. Grasser

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 912 KB

english, 2010

6

An analytical approach for physical modeling of hot-carrier induced degradation

S. Tyaginov, I. Starkov, H. Enichlmair, Ch. Jungemann, J.M. Park, E. Seebacher, R. Orio, H. Ceric, T. Grasser

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 907 KB

english, 2011

7

A compact model for early electromigration failures of copper dual-damascene interconnects

R.L. de Orio, H. Ceric, S. Selberherr

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 587 KB

english, 2011

8

Gesture and metaphor comprehension: Electrophysiological evidence of cross-modal coordination by audiovisual stimulation

Carlos Cornejo, Franco Simonetti, Agustín Ibáñez, Nerea Aldunate, Francisco Ceric, Vladimir López, Rafael E. Núñez

Journal:

Brain and Cognition

Year:

2009

Language:

english

File:

PDF, 852 KB

english, 2009

9

Through Silicon Via Reliability

Cassidy, C., Kraft, J., Carniello, S., Roger, F., Ceric, H., Singulani, A.P., Langer, E., Schrank, F.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2012

Language:

english

File:

PDF, 1.08 MB

english, 2012

10

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Hot-carrier degradation modeling using full-band Monte-Carlo simulations

Tyaginov, S.E., Starkov, I.A., Triebl, O., Cervenka, J., Jungemann, C., Carniello, S., Park, J.M., Enichlmair, H., Karner, M., Kernstock, Ch., Seebacher, E., Minixhofer, R., Ceric, H., Grasser, T.

Year:

2010

Language:

english

File:

PDF, 486 KB

english, 2010

11

[IEEE 2008 30th International Conference on Information Technology Interfaces (ITI) - Cavtat/Dubrovnik, Croatia (2008.06.23-2008.06.26)] ITI 2008 - 30th International Conference on Information Technology Interfaces - Algorithmic art: Technology, mathematics and art

Year:

2008

Language:

english

File:

PDF, 129 KB

english, 2008

12

Electromigration reliability of open TSV structures

Zisser, W.H., Ceric, H., Weinbub, J., Selberherr, S.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 755 KB

english, 2014

13

[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Electromigration reliability of open TSV structures

Zisser, Wolfhard H., Ceric, Hajdin, Weinbub, Josef, Selberherr, Siegfried

Year:

2014

Language:

english

File:

PDF, 782 KB

english, 2014

14

[IEEE 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) - South Lake Tahoe, CA, USA (2014.10.12-2014.10.16)] 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) - Dominant mechanisms of hot-carrier degradation in short- and long-channel transistors

Tyaginov, S., Bina, M., Franco, J., Wimmer, Y., Rudolf, F., Enichlmair, H., Park, J.-M., Kaczer, B., Ceric, H., Grasser, T.

Year:

2014

Language:

english

File:

PDF, 627 KB

english, 2014

15

Computation of rainfall distribution over the lines of a sewerage pipeline network

Journal:

Computer-Aided Design

Year:

1980

Language:

english

File:

PDF, 440 KB

english, 1980

16

Conduction processes in the Ta(-)/Ta2O5-electrolyte system

M. Metikos-Hukovic, M. Ceraj-Ceric

Journal:

Thin Solid Films

Year:

1986

Language:

english

File:

PDF, 564 KB

english, 1986

17

Investigation and design of parcel sorting systems in postal centres by simulation

Mario Vrgoč, Vlatko Čerić

Journal:

Computers in Industry

Year:

1988

Language:

english

File:

PDF, 692 KB

english, 1988

18

Electromigration in submicron interconnect features of integrated circuits

H. Ceric, S. Selberherr

Journal:

Materials Science and Engineering: R: Reports

Year:

2011

Language:

english

File:

PDF, 2.21 MB

english, 2011

19

Simulative prediction of the resistance change due to electromigration induced void evolution

Hajdin Ceric, Siegfried Selberherr

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 758 KB

2002

20

Three-dimensional simulation of sacrificial etching

Johann Cervenka, Hajdin Ceric, Siegfried Selberherr

Journal:

Microsystem Technologies

Year:

2008

Language:

english

File:

PDF, 362 KB

english, 2008

21

Physically based models of electromigration: From Black’s equation to modern TCAD models

R.L. de Orio, H. Ceric, S. Selberherr

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 916 KB

english, 2010

22

Visual interactive modeling and simulation as a decision support in railway transport logistic operations

Journal:

Mathematics and Computers in Simulation

Year:

1997

Language:

english

File:

PDF, 1.63 MB

english, 1997

23

Applicability of multicriteria decision aid to sustainable hydropower

B. Vučijak, T. Kupusović, S. Midžić-Kurtagić, A. Ćerić

Journal:

Year:

2013

Language:

english

File:

PDF, 180 KB

english, 2013

24

Interconnect reliability dependence on fast diffusivity paths

Hajdin Ceric, Roberto Lacerda de Orio, Siegfried Selberherr

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 903 KB

english, 2012

25

Electromigration failure in a copper dual-damascene structure with a through silicon via

R.L. de Orio, H. Ceric, S. Selberherr

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.18 MB

english, 2012

26

War trauma in Sarajevo

S. Loga, I. Ceric, E. Music

Journal:

European Psychiatry

Year:

2002

Language:

english

File:

PDF, 131 KB

english, 2002

27

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Electromigration anisotropy and mechanical stress in modern copper interconnect

Ceric, H., de Orio, R. L., Selberherr, S.

Year:

2010

Language:

english

File:

PDF, 657 KB

english, 2010

28

Synthesis, structure and tautomerism of two benzothiazolyl azo derivatives of 2-naphthol: A crystallographic, NMR and computational study

Racané, Livio, Mihalić, Zlatko, Cerić, Helena, Popović, Jasminka, Tralić-Kulenović, Vesna

Journal:

Dyes and Pigments

Year:

2013

Language:

english

File:

PDF, 667 KB

english, 2013

29

A Comprehensive TCAD Approach for Assessing Electromigration Reliability of Modern Interconnects

Ceric, H., de Orio, R.L., Cervenka, J., Selberherr, S.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2009

Language:

english

File:

PDF, 765 KB

english, 2009

30

[IEEE 2011 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Osaka, Japan (2011.09.8-2011.09.10)] 2011 International Conference on Simulation of Semiconductor Processes and Devices - Analysis of worst-case hot-carrier degradation conditions in the case of n- and p-channel high-voltage MOSFETs

Starkov, Ivan, Ceric, Hajdin, Tyaginov, Stanislav, Grasser, Tibor, Enichlmair, Hubert, Park, Jong-Mun, Jungemann, Christoph

Year:

2011

Language:

english

File:

PDF, 3.21 MB

english, 2011

31

Hot-carrier degradation caused interface state profile—Simulation versus experiment

Starkov, I., Tyaginov, S., Enichlmair, H., Cervenka, J., Jungemann, C., Carniello, S., Park, J. M., Ceric, H., Grasser, T.

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2011

Language:

english

File:

PDF, 812 KB

english, 2011

32

Stress evolution in the metal layers of TSVs with Bosch scallops

Singulani, A.P., Ceric, H., Selberherr, S.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 766 KB

english, 2013

33

[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Electromigration reliability of solder bumps

Ceric, Hajdin, Selberherr, Siegfried

Year:

2014

Language:

english

File:

PDF, 1.19 MB

english, 2014

34

Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

Rui Huang,, Robl, W., Ceric, H., Detzel, T., Dehm, G.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2010

Language:

english

File:

PDF, 853 KB

english, 2010

35

[IEEE 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (8-12 July 2002)] Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) - Electromigration induced evolution of voids in current crowding areas of interconnects

Ceric, H., Selberherr, S.

Year:

2002

Language:

english

File:

PDF, 417 KB

english, 2002

36

[IEEE 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Shangri-La's Rasa Sentosa Resort, Singapore (27 June-1July, 2005)] Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Comprehensive analysis of vacancy dynamics due to electromigration

Ceric, H., Deshpande, V., Hollauer, Ch., Holzer, S., Grasser, T., Selberherr, S.

Year:

2005

Language:

english

File:

PDF, 398 KB

english, 2005

37

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Stress evolution on tungsten thin-film of an open through silicon via technology

Singulani, A.P., Ceric, H., Langer, E.

Year:

2013

File:

PDF, 361 KB

2013

38

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Ab initio method for electromigration analysis

Ceric, H., De Orio, R. L., Zisser, W. H., Selberherr, S.

Year:

2012

Language:

english

File:

PDF, 738 KB

english, 2012

39

[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Three-Dimensional Transient Interconnect Analysis With Regard to Mechanical Stress

Holzer, S., Hollauer, C., Ceric, H., Karner, M., Grasser, T., Langer, E., Selberherr, S.

Year:

2006

Language:

english

File:

PDF, 1.72 MB

english, 2006

40

[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines

Ceric, H., Hollauer, Ch., Selberherr, S.

Year:

2006

Language:

english

File:

PDF, 1.40 MB

english, 2006

41

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - TCAD solutions for submicron copper interconnect

Ceric, H., de Orio, R. L., Cervenka, J., Selberherr, S.

Year:

2008

Language:

english

File:

PDF, 315 KB

english, 2008

42

[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - The effect of microstructure on the electromigration lifetime distribution

de Orio, R. L., Ceric, H., Cervenka, J., Selberherr, S.

Year:

2009

Language:

english

File:

PDF, 2.47 MB

english, 2009

43

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Analysis of solder bump electromigration reliability

Ceric, H., de Orio, R. L., Selberherr, S.

Year:

2013

File:

PDF, 312 KB

2013

44

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Integration of atomistic and continuum-level electromigration models

Ceric, H., de Orio, R. L., Selberherr, S.

Year:

2011

Language:

english

File:

PDF, 747 KB

english, 2011

45

[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - The effect of microstructure on electromigration induced voids

Ceric, H., de Orio, R. L., Cervenka, J., Selberherr, S.

Year:

2009

Language:

english

File:

PDF, 1.39 MB

english, 2009

46

[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Impact of Random Bit Values on NBTI Lifetime of an SRAM Cell

Wittmann, R., Puchner, H., Ceric, H., Selberherr, S.

Year:

2006

Language:

english

File:

PDF, 2.02 MB

english, 2006

47

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Analysis of worst-case hot-carrier conditions for high voltage transistors based on full-band monte-carlo simulations

Starkov, I.A., Tyaginov, S.E., Triebl, O., Cervenka, J., Jungemann, C., Carniello, S., Park, J.M., Enichlmair, H., Karner, M., Kernstock, Ch., Seebacher, E., Minixhofer, R., Ceric, H., Grasser, T.

Year:

2010

Language:

english

File:

PDF, 1.69 MB

english, 2010

48

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature

Huang, Rui, Robl, Werner, Dehm, Gerhard, Ceric, Hajdin, Detzel, Thomas

Year:

2010

Language:

english

File:

PDF, 2.12 MB

english, 2010

49

[IEEE 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Hong Kong, China (2015.5.10-2015.5.14)] 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Predictive and efficient modeling of hot-carrier degradation in nLDMOS devices

Sharma, Prateek, Tyaginov, Stanislav, Wimmer, Yannick, Rudolf, Florian, Rupp, Karl, Bina, Markus, Enichlmair, Hubert, Park, Jong-Mun, Ceric, Hajdin, Grasser, Tibor

Year:

2015

Language:

english

File:

PDF, 1.23 MB

english, 2015

50

Haplotype data for 23 Y-chromosome markers in a reference sample from Bosnia and Herzegovina

Kovačević, Lejla, Fatur-Cerić, Vera, Hadžić, Negra, Čakar, Jasmina, Primorac, Dragan, Marjanović, Damir

Journal:

Croatian Medical Journal

Year:

2013

Language:

english

File:

PDF, 252 KB

english, 2013

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